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Campus 2 (KEPZ)

  • Established in 2004, Production began in Sept, 2006. Completed 3 years in operation
  • 23 acre Campus with 1Mfg building for PCB
  • 450K SF (45K SM) Building area
  • Production capacity is ~500K SF/Mo. (50K SM/mo) for LC – ST/MT
  • Production capacity is~800K SF/Mo. (80K SM/mo) for Automotive LC – ST
  • Employees 760 and will be increased to 1100 by end of 2010

 

Campus 3 Qing Song

  • Construction comletion ~2011 June
  • LC- ST/MT/HT/HDI Backplane,Antenna, Heatsink, BC Heavy Cu
  • Capacity of 1.6 MN Sqft/mth

 

Campus 4 Huangshi

  • Established in 2011, 100% WUS China subsidiary, Started Manufacturing Q4, 2014
  • Dedicated for HMLV, Telecom Infrastructure and Server Market
  • Total Employee 1064
  • Total Investment committed 500 MN$ with 150 MN$ invested in Phase 1
  • Capacity : 1.0 MN Sqft/mth PCB capacity