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HDI

  • Various Constructions (Any Layer)
  • RCC or LD FR4
  • CO2 laser drills
  • Used in cellular or high-end line cards
  • Automotive Applications

ZAR

  • ZAR = Z-axis Routing
  • Layer count –up to 8L
  • Maximum thickness – 80mils (2.0mm)
  • Bendable layers: 1 layer, 2 layers, 3 layers
  • Bending angle:  <=90°
  • Copper thickness design: HOZ & 1OZ & 2OZ
  • Base Materials: IT158TC, PCL-FR370HR
  • Flexible Solder mask: PSR9000 FLX501, VT602
  • Depth routing tolerance control: +/-0.05mm
  • Automatic bending test.

Backplane

  • 6 to 50 layers
  • Reliability testing
  • Used as backbone of network switches/routers,
  • servers and basestations

Hybrid PCB's

  • 4 to 12 layers
  • Cost effective designs
  • Plasma etch
  • Experience:
  • High speed telecom

Heavy Copper

  • Defined as 3 oz. or higher
  • 2-18L, with blind/buried vias
  • Excellent reliability
  • UL approved to 12 oz. (400 ?m)
  • Power supplies, DC/DC converters, and inductor coils

Heatsinks (Metal-backed PCB)

  • Hybrid or Teflon PCB's
  • Bonded to thick Copper or Aluminium pallet
  • Experience with Pre-bonded, Post-bonded, and Coin designs
  • Bonding with adhesives or with hi-temp solder
  • CNC milling in-house and outcourced
  • Used in power amplifiers or RF modules

HF/Radar

  • HF = High frequency
  • Layer count-up to 8L
  • Material:
    - RO4000 Series, RO3000 Series, FR4
  • Structure:
    - Pure Rogers, Hybrid.
    - Single side, double side blind vias
  • Min. Blind vias (Drill hole size):
    - Mechanical: 0.20mm
    - Laser: 0.15mm
  • PCB used as short/medium/long distance
    - radar in automotive market for safety.