Technologien

HDI

• Various Constructions (Any Layer)
• RCC or LD FR4
• CO2 laser drills
• Used in cellular or high-end line cards
• Automotive Applications

ZAR

• ZAR = Z-axis Routing
• Layer count –up to 8L
• Maximum thickness – 80mils (2.0mm)
• Bendable layers: 1 layer, 2 layers, 3 layers
• Bending angle:  <=90°
• Copper thickness design: HOZ & 1OZ & 2OZ
• Base Materials: IT158TC, PCL-FR370HR
• Flexible Solder mask: PSR9000 FLX501, VT602
• Depth routing tolerance control: +/-0.05mm
• Automatic bending test.

Backplane

• 6 to 50 layers
• Reliability testing
• Used as backbone of network switches/routers,
• servers and basestations

Hybrid PCB’s

• 4 to 12 layers
• Cost effective designs
• Plasma etch
• Experience:
• High speed telecom

Heavy Copper

• Defined as 3 oz. or higher
• 2-18L, with blind/buried vias
• Excellent reliability
• UL approved to 12 oz. (400 ?m)
• Power supplies, DC/DC converters, and inductor coils

Heatsinks (Metal-Backed PCB)

• Hybrid or Teflon PCB’s
• Bonded to thick Copper or Aluminium pallet
• Experience with Pre-bonded, Post-bonded, and Coin designs
• Bonding with adhesives or with hi-temp solder
• CNC milling in-house and outcourced
• Used in power amplifiers or RF modules

HF / Radar

• HF = High frequency
• Layer count-up to 8L
• Material:
  – RO4000 Series, RO3000 Series, FR4
• Structure:
  – Pure Rogers, Hybrid.
  – Single side, double side blind vias
• Min. Blind vias (Drill hole size):
  – Mechanical: 0.20mm
  – Laser: 0.15mm
• PCB used as short/medium/long distance
  – radar in automotive market for safety.