Unsere Standorte

Campus 2 (KEPZ)

• Established in 2004, Production began in Sept, 2006. Completed 3 years in operation
• 23 acre Campus with 1Mfg building for PCB
• 450K SF (45K SM) Building area
• Production capacity is ~500K SF/Mo. (50K SM/mo) for LC – ST/MT
• Production capacity is~800K SF/Mo. (80K SM/mo) for Automotive LC – ST
• Employees 760 and will be increased to 1100 by end of 2010

Campus 3 Qing Song

• Construction comletion ~2011 June
• LC- ST/MT/HT/HDI Backplane,Antenna, Heatsink, BC Heavy Cu
• Capacity of 1.6 MN Sqft/mth

Campus 4 Huangshi

• Established in 2011, 100% WUS China subsidiary, Started Manufacturing Q4, 2014
• Dedicated for HMLV, Telecom Infrastructure and Server Market
• Total Employee 1064
• Total Investment committed 500 MN$ with 150 MN$ invested in Phase 1
• Capacity : 1.0 MN Sqft/mth PCB capacity